Patent Assignment Details
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| Reel/Frame: | 044012/0607 | |
| Pages: | 8 |
| | Recorded: | 11/01/2017 | | |
| Attorney Dkt #: | NAUP3135USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/18/2020
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Application #:
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15801308
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Filing Dt:
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11/01/2017
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Publication #:
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Pub Dt:
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04/04/2019
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Title:
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METHOD OF FORMING SEMICONDUCTOR DEVICE
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Assignees
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| NO.88, LIANHUA AVENUE, INTEGRATED CIRCUIT SCIENCE PARK, JINJIANG CITY |
| QUANZHOU CITY, FUJIAN PROVINCE, CHINA |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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