Patent Assignment Details
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Reel/Frame: | 032346/0609 | |
| Pages: | 12 |
| | Recorded: | 03/04/2014 | | |
Attorney Dkt #: | 42P55276 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/29/2019
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Application #:
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13930082
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Filing Dt:
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06/28/2013
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Publication #:
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Pub Dt:
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01/01/2015
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Title:
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UNDERFILL MATERIAL FLOW CONTROL FOR REDUCED DIE-TO-DIE SPACING IN SEMICONDUCTOR PACKAGES
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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JUSTIN K. BRASK
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1925 NW AMBERGLEN PARKWAY
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SUITE 230
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BEAVERTON, OR 97006
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