Patent Assignment Details
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Reel/Frame: | 044974/0609 | |
| Pages: | 6 |
| | Recorded: | 02/20/2018 | | |
Attorney Dkt #: | 170076US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/13/2020
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Application #:
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15720374
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Filing Dt:
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09/29/2017
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Publication #:
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Pub Dt:
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04/04/2019
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Title:
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POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY CONDUCTIVE PILLAR
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Assignee
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NO. 1 YISHUN AVENUE 7 |
SINGAPORE, SINGAPORE 768923 |
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Correspondence name and address
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AVAGO TECHNOLOGIES, LTD.
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4380 ZIEGLER ROAD
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FORT COLLINS, CO 80525
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