Patent Assignment Details
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| Reel/Frame: | 048523/0611 | |
| Pages: | 14 |
| | Recorded: | 03/06/2019 | | |
| Attorney Dkt #: | MI22-6714 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/2021
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Application #:
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16294759
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Filing Dt:
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03/06/2019
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Publication #:
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Pub Dt:
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09/10/2020
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Title:
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Integrated Assemblies Having Polycrystalline First Semiconductor Material Adjacent Conductively-Doped Second Semiconductor Material
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| MS 1-525 |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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WELLS ST. JOHN, P.S.
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601 W. MAIN AVENUE
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SUITE 600
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SPOKANE, WA 99201
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