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Patent Assignment Details
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Reel/Frame:018296/0613   Pages: 5
Recorded: 09/25/2006
Attorney Dkt #:HYPVG000
Conveyance: MERGER (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
12/16/1997
Application #:
08606638
Filing Dt:
02/26/1996
Title:
HIGH SPEED DIAMOND-BASED MACHINING OF SILICON SEMICONDUCTOR DIE IN WAFER AND PACKAGED FORM FOR BACKSIDE EMISSION MICROSCOPE DETECTION
2
Patent #:
Issue Dt:
05/04/2004
Application #:
09449023
Filing Dt:
11/24/1999
Title:
DYNAMIC STRUCTURAL COUPLING MECHANISM FOR REDUCING OPTICAL DEGRADATION IN VIBRATING ENVIRONMENTS
3
Patent #:
Issue Dt:
11/30/2004
Application #:
10397914
Filing Dt:
03/25/2003
Publication #:
Pub Dt:
11/27/2003
Title:
HIGH SENSITIVITY THERMAL RADIATION DETECTION WITH AN EMISSION MICROSCOPE WITH ROOM TEMPERATURE OPTICS
Assignor
1
Exec Dt:
05/19/2006
Assignee
1
1421 CALIFORNIA CIRCLE
MILPITAS, CALIFORNIA 95035-3099
Correspondence name and address
BEYER WEAVER & THOMAS LLP
P.O. BOX 70250
OAKLAND, CA 94612-0250

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