Patent Assignment Details
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| Reel/Frame: | 060629/0614 | |
| Pages: | 3 |
| | Recorded: | 07/26/2022 | | |
| Attorney Dkt #: | YX22_0006UP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17874063
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Filing Dt:
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07/26/2022
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Publication #:
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Pub Dt:
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02/01/2024
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Title:
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Epitaxial Substrate Having a 2D Material Interposer, Method for Manufacturing the Epitaxial Substrate, and Device Prepared from the Epitaxial Substrate
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Assignee
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| 14F., NO. 28, LN. 132, JILIN RD., LUZHU DIST. |
| TAOYUAN, TAIWAN |
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Correspondence name and address
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CHEYANG CHEN
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17700 CASTLETON ST, SUITE 373
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CITY OF INDUSTRY, CA 91748
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06/20/2024 04:54 PM
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