Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 026427/0615 | |
| Pages: | 8 |
| | Recorded: | 06/08/2011 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT INCORRECT SERIAL NO.12040399 TO CORRECT SERIAL NO. 13040399 PREVOIUSLY RECORDED ON REEL 026316, FRAME 0132. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/26/2013
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Application #:
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13040399
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Filing Dt:
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03/04/2011
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Publication #:
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Pub Dt:
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09/06/2012
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Title:
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SEMICONDUCTOR DEVICE COMPRISING METALLIZATION LAYERS OF REDUCED INTERLAYER CAPACITANCE BY REDUCING THE AMOUNT OF ETCH STOP MATERIALS
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Assignee
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| PO BOX 309, UGLAND HOUSE |
| MAPLES CORPORATE SERVICE LIMITED |
| GRAND CAYMAN, CAYMAN ISLANDS KY1 1104 |
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Correspondence name and address
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J. MIKE AMERSON
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10333 RICHMOND, SUITE 1100
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HOUSTON, TEXAS 77042
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