Patent Assignment Details
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Reel/Frame: | 035864/0617 | |
| Pages: | 5 |
| | Recorded: | 06/19/2015 | | |
Attorney Dkt #: | TI-71634 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/2015
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Application #:
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14444370
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Filing Dt:
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07/28/2014
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Title:
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Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe
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Assignee
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P.O. BOX 655474 MS 3999 |
DALLAS, TEXAS 75265 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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P.O. BOX 655474 MS 3999
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DALAS, TX 75265
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