Patent Assignment Details
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Reel/Frame: | 013477/0618 | |
| Pages: | 3 |
| | Recorded: | 11/01/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/09/2003
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Application #:
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10287155
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Filing Dt:
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11/01/2002
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Title:
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TI LINER FOR COPPER INTERCONNECT WITH LOW-K DIELECTRIC AND METHODS FOR MAKING THE SAME
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Assignee
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NO. 3, LI-HSIN ROAD II |
HSIN-CHU 30077, TAIWAN ROC |
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Correspondence name and address
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IBM CORPORATION
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IRA D. BLECKER
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DEPT. 18G/BLDG. 300-482
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2070 ROUTE 52
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HOPEWELL JUNCTION, NY 12533-6531
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