Patent Assignment Details
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Reel/Frame: | 005098/0619 | |
| Pages: | 2 |
| | Recorded: | 06/13/1989 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/25/1992
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Application #:
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07366089
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Filing Dt:
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06/13/1989
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Title:
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DIELECTRIC STRUCTURES HAVING EMBEDDED GAP FILLING RIE ETCH STOP POLYMERIC MATERIALS OF HIGH THERMAL STABILITY
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Correspondence name and address
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DANIEL P. MORRIS
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INTELLECTUAL PROPERTY LAW DEPT.,
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IBM CORP., P. O. BOX 218
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YORKTOWN HEIGHTS, NY 10598
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