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Patent Assignment Details
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Reel/Frame:005630/0619   Pages: 2
Recorded: 03/15/1991
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST.
Total properties: 1
1
Patent #:
Issue Dt:
09/15/1992
Application #:
07658783
Filing Dt:
02/20/1991
Title:
METHOD OF BONDING COPPER AND RESIN
Assignor
1
Exec Dt:
02/11/1991
Assignee
1
NO., 91, LANE 814
TA HSIN RD., HSIN CHUANG TSUN
LU CHU HSIANG, TAO YUAN HSIEN, TAIWAN R.O.C.
Correspondence name and address
ZARLEY, MCKEE, THOMTE, ET AL.
801 GRAND AVE., STE. 3200
DES MOINES, IA 50309

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