Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 044012/0619 | |
| Pages: | 7 |
| | Recorded: | 11/01/2017 | | |
| Attorney Dkt #: | UTACS2015SVE103 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
8
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Patent #:
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Issue Dt:
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02/02/2010
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Application #:
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11413408
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Filing Dt:
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04/27/2006
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Title:
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STRIP SOCKET HAVING A RECESSED PORTIONS IN THE BASE TO ACCEPT BOTTOM SURFACE OF PACKAGED SEMICONDUCTOR DEVICES MOUNTED ON A LEADFRAME FOR TESTING AND BURN-IN
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Patent #:
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Issue Dt:
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07/18/2017
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Application #:
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12002054
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Filing Dt:
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12/14/2007
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Title:
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Molded leadframe substrate semiconductor package
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Patent #:
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Issue Dt:
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04/13/2010
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Application #:
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12080677
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Filing Dt:
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04/04/2008
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Publication #:
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Pub Dt:
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08/07/2008
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Title:
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A STRIP SOCKET FOR TESTING AND BURN-IN HAVING RECESSED PORTIONS WITH MATERIAL THAT EXTENDS ACROSS A BOTTOM SURFACE OF THE CORRESPONDING SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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09/12/2017
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Application #:
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12231710
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Filing Dt:
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09/04/2008
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Title:
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Flip chip cavity package
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Patent #:
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Issue Dt:
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11/24/2015
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Application #:
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12378119
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Filing Dt:
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02/10/2009
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Title:
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MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12928067
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Filing Dt:
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12/02/2010
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE CONTAINING FLIP-CHIP ARRANGEMENT
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Patent #:
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Issue Dt:
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07/19/2016
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Application #:
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13689531
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Filing Dt:
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11/29/2012
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Publication #:
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Pub Dt:
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06/16/2016
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Title:
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POST-MOLD FOR SEMICONDUCTOR PACKAGE HAVING EXPOSED TRACES
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Patent #:
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Issue Dt:
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05/31/2016
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Application #:
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13710152
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Filing Dt:
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12/10/2012
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Title:
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AUXILIARY LEADFRAME MEMBER FOR STABILIZING THE BOND WIRE PROCESS
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Assignee
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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Correspondence name and address
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HORIZON IP PTE. LTD.
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7500A BEACH ROAD, #04-306/308
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THE PLAZA
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SINGAPORE, 199591 SINGAPORE
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