Patent Assignment Details
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| Reel/Frame: | 013073/0620 | |
| Pages: | 3 |
| | Recorded: | 04/16/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/03/2005
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Application #:
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10066645
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Filing Dt:
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02/06/2002
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Publication #:
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Pub Dt:
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08/21/2003
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Title:
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DIELECTRIC RECESS FOR WAFER-TO-WAFER AND DIE-TO-DIE METAL BONDING AND METHOD OF FABRICATING THE SAME
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Assignee
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| SC4-202 |
| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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ANTONELLI, TERRY, STOUT ET AL.
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HUNG H. BUI
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1300 NORTH SEVENTEENTH STREET
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SUITE 1800
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ARLINGTON, VA 22209
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