Patent Assignment Details
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Reel/Frame: | 014619/0620 | |
| Pages: | 3 |
| | Recorded: | 10/17/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10617467
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Filing Dt:
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07/11/2003
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Publication #:
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Pub Dt:
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01/13/2005
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Title:
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Method of inhibiting corrosion of copper plated or metallized surfaces and circuitry during semiconductor manufacturing processes
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Assignee
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ONDEO NALCO CENTER |
NAPERVILLE, ILLINOIS 60563-1198 |
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Correspondence name and address
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ONDEO NALCO COMPANY
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MICHAEL B. MARTIN
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PATENT AND LICENSING DEPT.
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ONDEO NALCO CENTER
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NAPERVILLE, IL 60563-1198
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