Patent Assignment Details
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| Reel/Frame: | 014974/0620 | |
| Pages: | 3 |
| | Recorded: | 02/06/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/01/2008
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Application #:
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10772242
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Filing Dt:
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02/06/2004
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Publication #:
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Pub Dt:
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08/12/2004
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Title:
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MOLD DIE FOR MOLDING CHIP ARRAY, MOLDING EQUIPMENT INCLUDING THE SAME, AND METHOD FOR MOLDING CHIP ARRAY
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Assignee
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| 416 MAETAN-DONG, YEONGTONG-GU SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE , P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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