Patent Assignment Details
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| Reel/Frame: | 040978/0620 | |
| Pages: | 3 |
| | Recorded: | 01/16/2017 | | |
| Attorney Dkt #: | ONS02281 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/16/2018
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Application #:
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15407224
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Filing Dt:
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01/16/2017
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Publication #:
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Pub Dt:
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07/19/2018
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Title:
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SEMICONDUCTOR DIE AND METHOD OF PACKAGING MULTI-DIE WITH IMAGE SENSOR
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Assignee
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| 5005 E. MCDOWELL ROAD |
| MAILDROP A700 |
| PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MAILDROP A700
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PHOENIX, AZ 85008
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