Patent Assignment Details
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Reel/Frame: | 015944/0621 | |
| Pages: | 6 |
| | Recorded: | 10/29/2004 | | |
Attorney Dkt #: | 4611-060 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10976732
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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01/19/2006
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Title:
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Method of fabricating PCB including embedded passive chip
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Assignee
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314, MAETAN-3DONG, YOUNGTONG-GU, SUWON-SI |
KYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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Correspondence name and address
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GOTTLIEB RACKMAN & REISMAN, P.C.
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270 MADISON AVENUE, 8TH FLOOR
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NEW YORK, NEW YORK 10016-0601
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