Patent Assignment Details
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| Reel/Frame: | 008002/0623 | |
| Pages: | 4 |
| | Recorded: | 06/20/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/17/1998
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Application #:
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08588172
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Filing Dt:
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01/18/1996
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH IMPROVED HEAT DISSIPATION AND DEHUMIDIFICATION EFFECT
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Assignees
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| 280-8 SUNGSU 2-GA SUNGDONG KU |
| SEOUL 133-120, KOREA, REPUBLIC OF |
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| 1347 N. ALMA SCHOOL RD. SUITE 100 |
| 280-8 SUNGSU 2-GA SUNGDONG KU |
| CHANDLER, ARIZONA 85224 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL
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ALAN H. MACPHERSON
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25 METRO DRIVE SUITE 700
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SAN JOSE CA 95110
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