Patent Assignment Details
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| Reel/Frame: | 026996/0623 | |
| Pages: | 6 |
| | Recorded: | 09/30/2011 | | |
| Attorney Dkt #: | 564-0004 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/16/2013
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Application #:
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13262293
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Filing Dt:
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09/30/2011
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Publication #:
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Pub Dt:
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02/09/2012
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Title:
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DEVICE OF FILLING METAL IN THROUGH-VIA-HOLE OF SEMICONDUCTOR WAFER AND METHOD USING THE SAME
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Assignee
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| 35-3 HONGCHEON-RI, IPJANG-MYUN, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 331-825 |
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Correspondence name and address
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SHERR & VAUGHN, PLLC
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620 HERNDON PARKWAY
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SUITE 320
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HERNDON, VA 20170
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