Patent Assignment Details
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Reel/Frame: | 041798/0623 | |
| Pages: | 3 |
| | Recorded: | 03/30/2017 | | |
Attorney Dkt #: | 035706-0368-00-US-550931 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/15/2019
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Application #:
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15405517
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Filing Dt:
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01/13/2017
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Publication #:
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Pub Dt:
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07/20/2017
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Title:
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Copper Foil, Copper-Clad Laminate Board, Method for Producing Printed Wiring Board, Method for Producing Electronic Apparatus, Method for Producing Transmission Channel, and Method for Producing Antenna
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Assignee
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1-2 OTEMACHI 1-CHOME |
CHIYODA-KU |
TOKYO, JAPAN 1008164 |
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Correspondence name and address
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DRINKER BIDDLE & REATH LLP
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ONE LOGAN SQUARE, SUITE 2000
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PHILADELPHIA, PA 19103-6996
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