Patent Assignment Details
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| Reel/Frame: | 013444/0624 | |
| Pages: | 4 |
| | Recorded: | 10/29/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2005
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Application #:
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10282637
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Filing Dt:
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10/29/2002
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Publication #:
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Pub Dt:
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05/22/2003
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Title:
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Multi-chip module packaging device using flip-chip bonding technology
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Assignee
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| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE KAOSHIUNG |
| KAOSHIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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HAROLD V. STOTLAND
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SEYFARTH SHAW
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55 EAST MONROE STREET SUITE 4200
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CHICAGO, LLLINOIS 60603-5803
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