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Reel/Frame:041937/0624   Pages: 2
Recorded: 04/10/2017
Attorney Dkt #:1602001CN01-US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/05/2019
Application #:
15482982
Filing Dt:
04/10/2017
Publication #:
Pub Dt:
03/01/2018
Title:
INTERLEAVED PARALLEL CIRCUIT, INTEGRATED POWER MODULE AND INTEGRATED POWER CHIP
Assignors
1
Exec Dt:
11/17/2016
2
Exec Dt:
11/17/2016
3
Exec Dt:
11/17/2016
Assignee
1
1F&7F&8F, BUILDING 1, NO.1675 HUADONG ROAD, PUDONG
SHANGHAI, CHINA 201209
Correspondence name and address
YUNLING REN
C/O EATON & VAN WINKLE
3 PARK AVENUE
NEW YORK, NY 10016

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