Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 036233/0625 | |
| Pages: | 4 |
| | Recorded: | 07/31/2015 | | |
Attorney Dkt #: | 98P000931US.CIP.DIV |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
07/04/2017
|
Application #:
|
14815918
|
Filing Dt:
|
07/31/2015
|
Publication #:
|
|
Pub Dt:
|
11/26/2015
| | | | |
Title:
|
METHOD OF MANUFACTURING A MULTICHIP PACKAGE STRUCTURE
|
|
Assignee
|
|
|
3F., NO. 369, SEC. 2, WENHUA 2ND RD., LINKOU DIST. |
NEW TAIPEI CITY, TAIWAN 244 |
|
Correspondence name and address
|
|
CHAO-CHANG DAVID PAI
|
|
1001 4TH AVENUE, SUITE 3200
|
|
SEATTLE, WA 98154
|
Search Results as of:
06/26/2024 12:34 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|