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Patent Assignment Details
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Reel/Frame:015456/0626   Pages: 2
Recorded: 06/10/2004
Attorney Dkt #:300.1169
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10864334
Filing Dt:
06/10/2004
Publication #:
Pub Dt:
12/23/2004
Title:
Wiring board, semiconductor device and process of fabricating wiring board
Assignor
1
Exec Dt:
05/24/2004
Assignee
1
80, OSHIMADA-MACHI
NAGANO-SHI, NAGANO 381-2287, JAPAN
Correspondence name and address
STAAS & HALSEY LLP
ALICIA M. CHOI
1201 NEW YORK AVE., N.W., SUITE 700
WASHINGTON, D.C. 20005

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