Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 023144/0626 | |
| Pages: | 3 |
| | Recorded: | 08/25/2009 | | |
| Attorney Dkt #: | 022111-003400US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2011
|
Application #:
|
12475362
|
Filing Dt:
|
05/29/2009
|
|
Publication #:
|
|
Pub Dt:
|
04/29/2010
| | | | |
|
Title:
|
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
|
|
|
Assignee
|
|
|
|
|
| S-SITE, LOT 52986 TAMAN MERU INDUSTRIAL ESTATE |
| JELAPANG, P.O. BOX 380, IPOH |
| PERAK DARUL RIDZUAN, MALAYSIA 30720 |
|
|
Correspondence name and address
|
| |
WILLIAM L. SHAFFER
|
| |
TOWNSEND AND TOWNSEND AND CREW LLP
|
| |
TWO EMBARCADERO CENTER, 8TH FLOOR
|
| |
SAN FRANCISCO, CA 94111-3834
|
Search Results as of:
06/17/2024 09:04 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
