Patent Assignment Details
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| Reel/Frame: | 024462/0626 | |
| Pages: | 5 |
| | Recorded: | 05/28/2010 | | |
| Attorney Dkt #: | TESHEL 3.O-007 DIV CONT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/10/2011
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Application #:
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11588489
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Filing Dt:
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10/26/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Title:
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CHIP PACKAGES WITH COVERS
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Assignee
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| C/O TMF HUNGARY LTD. |
| WESSELENYI U. 16 |
| BUDAPEST, HUNGARY 1077 |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, KRUMHOLZ
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& MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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