Patent Assignment Details
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Reel/Frame: | 028718/0627 | |
| Pages: | 4 |
| | Recorded: | 08/03/2012 | | |
Attorney Dkt #: | 8100-1036 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13513403
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Filing Dt:
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08/03/2012
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Publication #:
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Pub Dt:
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11/29/2012
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Title:
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METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
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Assignees
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1-1, SHIN-OGURA, SAIWAI-KU, KAWASAKI-SHI |
KANAGAWA, JAPAN 212-0031 |
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465, OSATO-CHO, KOFU-SHI |
YAMANASHI, JAPAN 400-0053 |
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Correspondence name and address
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YOUNG & THOMPSON
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209 MADISON STREET
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SUITE 500
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ALEXANDRIA, VA 22314
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