Patent Assignment Details
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| Reel/Frame: | 024425/0628 | |
| Pages: | 5 |
| | Recorded: | 05/21/2010 | | |
| Attorney Dkt #: | 54605 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11484544
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Filing Dt:
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07/10/2006
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Publication #:
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Pub Dt:
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01/10/2008
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Title:
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METHOD FOR BONDING WAFERS TO PRODUCE STACKED INTEGRATED CIRCUITS
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Assignee
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| 1415 BOND ST., SUITE 111 |
| NAPERVILLE, ILLINOIS 60563 |
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Correspondence name and address
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LAW OFFICES OF CALVIN B. WARD
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18 CROW CANYON CT., SUITE 305
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SAN RAMON, CA 94583
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