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Patent Assignment Details
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Reel/Frame:017898/0629   Pages: 6
Recorded: 05/19/2006
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
11361613
Filing Dt:
02/24/2006
Publication #:
Pub Dt:
09/07/2006
Title:
Planar microspring integrated circuit chip interconnection to next level
Assignors
1
Exec Dt:
04/08/2006
2
Exec Dt:
03/31/2006
3
Exec Dt:
04/05/2006
Assignees
1
10 KENT RIDGE CRESCENT
SINGAPORE, SINGAPORE 119260
2
20 BIOPOLIS STREET, #07-01
CENTROS, SINGAPORE 138668
3
505 TENTH STREET, NW, GEORGIA INSTITUTE OF TECHNOLOGY
ATLANTA, GEORGIA 30332-0420
Correspondence name and address
MICHAEL W. TAYLOR, ESQ.
ALLEN, DYER, DOPPELT ETAL.
255 S ORANGE AVENUE, SUITE 1401
ORLANDO, FL 32801

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