Total properties:
392
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Patent #:
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Issue Dt:
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08/13/2002
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Application #:
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09615107
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Filing Dt:
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07/13/2000
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Title:
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PLASTIC INTERGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
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Patent #:
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Issue Dt:
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05/13/2003
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Application #:
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09615670
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Filing Dt:
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07/14/2000
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Title:
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MICROCIRCUIT DIE-SAWING PROTECTOR
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09620444
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Filing Dt:
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07/20/2000
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Title:
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SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES AND BOND WIRES
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Patent #:
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Issue Dt:
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07/23/2002
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Application #:
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09631449
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Filing Dt:
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08/02/2000
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Title:
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SEMICONDUCTOR CHIP HAVING A RADIO-FREQUENCY IDENTIFICATION TRANSCEIVER
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Patent #:
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Issue Dt:
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09/03/2002
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Application #:
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09634496
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Filing Dt:
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08/08/2000
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Title:
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D-SORBITOL DEHYDROGENASE GENE
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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09648284
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Filing Dt:
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08/24/2000
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
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Patent #:
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Issue Dt:
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10/22/2002
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Application #:
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09648946
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Filing Dt:
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08/23/2000
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Title:
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CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
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Patent #:
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Issue Dt:
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06/18/2002
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Application #:
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09654978
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Filing Dt:
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09/05/2000
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Title:
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WAFER LEVEL PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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06/10/2003
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Application #:
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09655439
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Filing Dt:
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09/05/2000
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Title:
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CHIP SIZE SEMICONDUCTOR PACKAGES WITH STACKED DIES
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Patent #:
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Issue Dt:
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09/23/2003
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Application #:
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09656253
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Filing Dt:
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09/06/2000
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Title:
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SEMICONDUCTOR MEMORY CARDS AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09659017
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Filing Dt:
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09/08/2000
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Title:
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MULTIPLE DIE LEAD FRAME PACKAGE WITH ENHANCED DIE-TO DIE INTERCONNECT ROUTING USING INTERNAL LEAD TRACE WIRING
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Patent #:
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Issue Dt:
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02/18/2003
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Application #:
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09670499
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Filing Dt:
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09/26/2000
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Title:
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MICROMACHINE STACKED WIREBONDED PACKAGE
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Patent #:
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Issue Dt:
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10/28/2003
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Application #:
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09670500
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Filing Dt:
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09/26/2000
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Title:
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MICROMACHINE STACKED WIREBONDED PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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03/11/2003
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Application #:
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09670501
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Filing Dt:
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09/26/2000
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Title:
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MICROMACHINE STACKED FLIP CHIP PACKAGE FABRICATION METHOD
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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09687049
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Filing Dt:
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10/13/2000
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Title:
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SEMICONDUCTOR DEVICE HAVING INCREASED MOISTURE PATH AND INCREASED SOLDER JOINT STRENGTH
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|
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Patent #:
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|
Issue Dt:
|
09/09/2003
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Application #:
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09687126
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Filing Dt:
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10/13/2000
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Title:
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APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGES
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Patent #:
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Issue Dt:
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09/30/2003
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Application #:
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09687331
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Filing Dt:
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10/13/2000
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Title:
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LEADFRAME FOR SEMICONDUCTOR PACKAGE AND MOLD FOR MOLDING THE SAME
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Patent #:
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Issue Dt:
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12/31/2002
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Application #:
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09687485
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Filing Dt:
|
10/13/2000
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Title:
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SEMICONDUCTOR PACKAGE HAVING INCREASED SOLDER JOINT STRENGTH
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09687487
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Filing Dt:
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10/13/2000
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Title:
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CLAMP AND HEAT BLOCK ASSEMBLY FOR WIRE BONDING A SEMICONDUCTOR PACKAGE ASSEMBLY
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Patent #:
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|
Issue Dt:
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02/08/2005
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Application #:
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09687493
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Filing Dt:
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10/13/2000
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Title:
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SEMICONDUCTOR PACKAGE HAVING IMPROVED ADHESIVENESS AND GROUND BONDING
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Patent #:
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Issue Dt:
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06/22/2004
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Application #:
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09687495
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Filing Dt:
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10/13/2000
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Title:
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ENCAPSULATED SEMICONDUCTOR PACKAGE INCLUDING CHIP PADDLE AND LEADS
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Patent #:
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|
Issue Dt:
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05/04/2004
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Application #:
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09687530
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Filing Dt:
|
10/13/2000
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
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Patent #:
|
|
Issue Dt:
|
08/12/2003
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Application #:
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09687531
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Filing Dt:
|
10/13/2000
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Title:
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STACKABLE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
|
11/05/2002
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Application #:
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09687532
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Filing Dt:
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10/13/2000
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Title:
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METHOD FOR MAKING A SEMICONDUCTOR PACKAGE HAVING IMPROVED DEFECT TESTING AND INCREASED PRODUCTION YIELD
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Patent #:
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|
Issue Dt:
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01/13/2004
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Application #:
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09687536
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Filing Dt:
|
10/13/2000
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Title:
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END GRID ARRAY SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
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04/29/2003
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Application #:
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09687541
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Filing Dt:
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10/13/2000
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Title:
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SEMICONDUCTOR PACKAGE LEADFRAME ASSEMBLY AND METHOD OF MANUFACTURE
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Patent #:
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|
Issue Dt:
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02/24/2004
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Application #:
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09687585
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Filing Dt:
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10/13/2000
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Title:
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SEMICONDUCTOR PACKAGE HAVING REDUCED THICKNESS
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Patent #:
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|
Issue Dt:
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11/11/2003
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Application #:
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09687787
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Filing Dt:
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10/13/2000
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Title:
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THIN AND HEAT RADIANT SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING
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Patent #:
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Issue Dt:
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10/28/2003
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Application #:
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09687876
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Filing Dt:
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10/13/2000
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Title:
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NEAR CHIP SIZE SEMICONDUCTOR PACKAGE
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Patent #:
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|
Issue Dt:
|
01/22/2002
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Application #:
|
09693466
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Filing Dt:
|
10/20/2000
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Title:
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Method of fabricating semiconductor device
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|
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Patent #:
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|
Issue Dt:
|
02/18/2003
|
Application #:
|
09703195
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Filing Dt:
|
10/31/2000
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Title:
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PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE AND METHOD FOR MAKING THE PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
01/21/2003
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Application #:
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09711993
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Filing Dt:
|
11/13/2000
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Title:
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CHIP SIZE IMAGE SENSOR IN WIREBOND PACKAGE WITH STEP-UP RING FOR ELECTRICAL CONTACT
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|
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Patent #:
|
|
Issue Dt:
|
10/07/2003
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Application #:
|
09711994
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Filing Dt:
|
11/13/2000
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Title:
|
CHIP SIZE IMAGE SENSOR BUMPER PACKAGE FABRICATION METHOD
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|
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Patent #:
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|
Issue Dt:
|
03/04/2003
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Application #:
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09712313
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Filing Dt:
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11/13/2000
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Title:
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CHIP SIZE IMAGE SENSOR BUMPED PACKAGE
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Patent #:
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|
Issue Dt:
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09/16/2003
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Application #:
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09712314
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Filing Dt:
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11/13/2000
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Title:
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CHIP SIZE IMAGE SENSOR WIREBOND PACKAGE FABRICATION METHOD
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Patent #:
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|
Issue Dt:
|
02/01/2005
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Application #:
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09713848
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Filing Dt:
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11/15/2000
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Title:
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FLIP CHIP ON GLASS IMAGE SENSOR PACKAGE
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Patent #:
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|
Issue Dt:
|
03/11/2003
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Application #:
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09714622
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Filing Dt:
|
11/16/2000
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Title:
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ANGULATED SEMICONDUCTOR PACKAGES
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Patent #:
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|
Issue Dt:
|
01/29/2002
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Application #:
|
09714682
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Filing Dt:
|
11/15/2000
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Title:
|
Flip chip on glass image sensor package fabrication method
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Patent #:
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|
Issue Dt:
|
01/22/2002
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Application #:
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09730721
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Filing Dt:
|
12/06/2000
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Title:
|
Making semiconductor packages with stacked dies and reinforced wire bonds
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|
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Patent #:
|
|
Issue Dt:
|
05/20/2003
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Application #:
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09733148
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Filing Dt:
|
12/07/2000
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Title:
|
EXPOSED COPPER STRAP IN A SEMICONDUCTOR PACKAGE
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|
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Patent #:
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|
Issue Dt:
|
11/04/2003
|
Application #:
|
09745265
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Filing Dt:
|
12/20/2000
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Publication #:
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|
Pub Dt:
|
05/30/2002
| | | | |
Title:
|
WIRE BONDING METHOD AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
01/06/2004
|
Application #:
|
09751536
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Filing Dt:
|
12/29/2000
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Title:
|
OPTICAL FIBER HAVING TAPERED END AND OPTICAL CONNECTOR WITH RECIPROCAL OPENING
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|
|
Patent #:
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|
Issue Dt:
|
04/05/2005
|
Application #:
|
09751537
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Filing Dt:
|
12/29/2000
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Publication #:
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|
Pub Dt:
|
12/09/2004
| | | | |
Title:
|
TOOL AND METHOD FOR FORMING AN INTEGRATED OPTICAL CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2003
|
Application #:
|
09752244
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Filing Dt:
|
12/28/2000
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Title:
|
METHOD OF MAKING AND STACKING A SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09752662
|
Filing Dt:
|
12/28/2000
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Title:
|
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09754229
|
Filing Dt:
|
01/03/2001
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Title:
|
METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09754239
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Filing Dt:
|
01/03/2001
|
Title:
|
METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09754393
|
Filing Dt:
|
01/03/2001
|
Title:
|
BOND WIRE PRESSURE SENSOR DIE PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
09764165
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Filing Dt:
|
01/16/2001
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Title:
|
OPTICAL MODULE WITH LENS INTEGRAL HOLDER
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|
|
Patent #:
|
|
Issue Dt:
|
08/26/2003
|
Application #:
|
09764166
|
Filing Dt:
|
01/16/2001
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Title:
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METHOD FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE
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|
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Patent #:
|
|
Issue Dt:
|
06/03/2003
|
Application #:
|
09764190
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Filing Dt:
|
01/16/2001
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Title:
|
STRUCTURE FOR FABRICATING A SPECIAL-PURPOSE DIE USING A POLYMERIZABLE TAPE
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|
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Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09770859
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Filing Dt:
|
01/26/2001
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Title:
|
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE
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|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09770861
|
Filing Dt:
|
01/26/2001
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Title:
|
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
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|
|
Patent #:
|
|
Issue Dt:
|
07/13/2004
|
Application #:
|
09774952
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Filing Dt:
|
01/30/2001
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Publication #:
|
|
Pub Dt:
|
06/28/2001
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE HAVING SEMICONDUCTOR CHIP WITHIN CENTRAL APERTURE OF SUBSTRATE
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|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
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Application #:
|
09783797
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Filing Dt:
|
02/14/2001
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Title:
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PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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|
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Patent #:
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|
Issue Dt:
|
06/04/2002
|
Application #:
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09797756
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Filing Dt:
|
03/01/2001
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Title:
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METHOD OF SINGULATION USING LASER CUTTING
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Patent #:
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|
Issue Dt:
|
07/16/2002
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Application #:
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09797759
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Filing Dt:
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03/01/2001
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Title:
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STRUCTURE INCLUDING ELECTRONIC COMPONENTS SINGULATED USING LASER CUTTING
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Patent #:
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|
Issue Dt:
|
03/22/2005
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Application #:
|
09803083
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Filing Dt:
|
03/08/2001
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Title:
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BACK-SIDE WAFER SINGULATION METHOD
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Patent #:
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|
Issue Dt:
|
09/13/2005
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Application #:
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09803084
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Filing Dt:
|
03/08/2001
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Title:
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Wafer having alignment marks extending from a first to a second surface of the wafer
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Patent #:
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|
Issue Dt:
|
09/24/2002
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Application #:
|
09804749
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Filing Dt:
|
03/12/2001
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Title:
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MICROMIRROR DEVICE PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
09/23/2003
|
Application #:
|
09804805
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Filing Dt:
|
03/12/2001
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Title:
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MICROMIRROR DEVICE PACKAGE FABRICATION METHOD
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|
|
Patent #:
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|
Issue Dt:
|
06/17/2003
|
Application #:
|
09811183
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Filing Dt:
|
03/14/2001
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Title:
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STRUCTURE FOR PROTECTING A MICROMACHINE WITH A CAVITY IN A UV TAPE
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|
|
Patent #:
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|
Issue Dt:
|
11/26/2002
|
Application #:
|
09812426
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Filing Dt:
|
03/19/2001
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Title:
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SEMICONDUCTOR PACKAGE WITH WARPAGE RESISTANT SUBSTRATE
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|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09813485
|
Filing Dt:
|
03/20/2001
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Title:
|
MOUNTING FOR A PACKAGE CONTAINING A CHIP
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|
|
Patent #:
|
|
Issue Dt:
|
07/06/2004
|
Application #:
|
09816599
|
Filing Dt:
|
03/23/2001
|
Publication #:
|
|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS WITH ALIGNED INPUT/OUTPUT PADS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2005
|
Application #:
|
09816852
|
Filing Dt:
|
03/23/2001
|
Publication #:
|
|
Pub Dt:
|
02/21/2002
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
09825785
|
Filing Dt:
|
04/04/2001
|
Title:
|
THERMALLY ENHANCED CHIP SCALE LEAD ON CHIP SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/04/2003
|
Application #:
|
09827619
|
Filing Dt:
|
04/06/2001
|
Title:
|
SEMICONDUCTOR PACKAGE WITH MOLDED SUBSTRATE AND RECESSED INPUT/OUTPUT TERMINALS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/29/2004
|
Application #:
|
09827791
|
Filing Dt:
|
04/06/2001
|
Title:
|
MAKING TWO LEAD SURFACE MOUNTING HIGH POWER MICROLEADFRAME SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2003
|
Application #:
|
09828046
|
Filing Dt:
|
04/06/2001
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Title:
|
MAKING LEADFRAME SEMICONDUCTOR PACKAGES WITH STACKED DIES AND INTERCONNECTING INTERPOSER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09828396
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Filing Dt:
|
04/06/2001
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Title:
|
MAKING SEMICONDUCTOR DEVICES HAVING STACKED DIES WITH BIASED BACK SURFACES
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|
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Patent #:
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Issue Dt:
|
09/14/2004
|
Application #:
|
09829341
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Filing Dt:
|
04/09/2001
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Title:
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STACKABLE LEAD FRAME PACKAGE USING EXPOSED INTERNAL LEAD TRACES
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|
|
Patent #:
|
|
Issue Dt:
|
06/17/2003
|
Application #:
|
09839284
|
Filing Dt:
|
04/20/2001
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Title:
|
HEAT SPREADER WITH SPRING IC PACKAGE
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|
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Patent #:
|
|
Issue Dt:
|
05/13/2003
|
Application #:
|
09839288
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Filing Dt:
|
04/20/2001
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Title:
|
HEAT SPREADER WITH SPRING IC PACKAGE FABRICATION METHOD
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Patent #:
|
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Issue Dt:
|
03/04/2003
|
Application #:
|
09839305
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Filing Dt:
|
04/20/2001
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Title:
|
VACUUM SEALED PACKAGE FOR SEMICONDUCTOR CHIP
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|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09839861
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Filing Dt:
|
04/20/2001
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
Title:
|
METHOD OF MAKING A PLASTIC PAKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE
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|
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Patent #:
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|
Issue Dt:
|
09/02/2003
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Application #:
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09848864
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Filing Dt:
|
05/04/2001
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Title:
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SHIELDED SEMICONDUCTOR LEADFRAME PACKAGE
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Patent #:
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|
Issue Dt:
|
03/16/2004
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Application #:
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09848932
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Filing Dt:
|
05/04/2001
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Title:
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SHIELDED SEMICONDUCTOR PACKAGE WITH SINGLE-SIDED SUBSTRATE AND METHOD FOR MAKING THE SAME
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Patent #:
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|
Issue Dt:
|
09/16/2003
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Application #:
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09851564
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Filing Dt:
|
05/08/2001
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Publication #:
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Pub Dt:
|
01/03/2002
| | | | |
Title:
|
SHEET RESIN COMPOSITION
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Patent #:
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|
Issue Dt:
|
02/03/2004
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Application #:
|
09855244
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Filing Dt:
|
05/14/2001
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Title:
|
MULTI-CHIP SEMICONDUCTOR PACKAGE WITH INTEGRAL SHIELD AND ANTENNA
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|
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Patent #:
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|
Issue Dt:
|
07/01/2003
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Application #:
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09863359
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Filing Dt:
|
05/22/2001
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Publication #:
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Pub Dt:
|
03/07/2002
| | | | |
Title:
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PLASTIC INTEGRATED CIRCUIT DEVICE PACKAGE HAVING EXPOSED LEAD SURFACE
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Patent #:
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|
Issue Dt:
|
08/06/2002
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Application #:
|
09866100
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Filing Dt:
|
05/25/2001
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Title:
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ACTIVE HEAT SINK FOR COOLING A SEMICONDUCTOR CHIP
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|
|
Patent #:
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|
Issue Dt:
|
12/30/2003
|
Application #:
|
09871993
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Filing Dt:
|
06/04/2001
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Publication #:
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|
Pub Dt:
|
04/25/2002
| | | | |
Title:
|
IMAGE SENSING COMPONENT PACKAGE AND MANUFACTURE METHOD THEREOF
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|
|
Patent #:
|
|
Issue Dt:
|
10/14/2003
|
Application #:
|
09880277
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Filing Dt:
|
06/13/2001
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Publication #:
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|
Pub Dt:
|
01/02/2003
| | | | |
Title:
|
PERSONALIZED CIRCUIT MODULE PACKAGE AND METHOD FOR PACKAGING CIRCUIT MODULES
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|
|
Patent #:
|
|
Issue Dt:
|
09/30/2003
|
Application #:
|
09881343
|
Filing Dt:
|
06/13/2001
|
Title:
|
HERMETIC CERAMIC SEMICONDUCTOR PACKAGE
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|
|
Patent #:
|
|
Issue Dt:
|
07/01/2003
|
Application #:
|
09881344
|
Filing Dt:
|
06/13/2001
|
Title:
|
INTEGRATED CIRCUIT PACKAGE HAVING POSTS FOR CONNECTION TO OTHER PACKAGES AND SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09884357
|
Filing Dt:
|
06/18/2001
|
Title:
|
METHOD AND APPARATUS FOR ATTACHING MULTIPLE METAL COMPONENTS TO INTEGRATED CIRCUIT MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2003
|
Application #:
|
09888950
|
Filing Dt:
|
06/25/2001
|
Title:
|
METHOD OF MAKING A CHIP CARRIER PACKAGE USING LASER ABLATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/20/2004
|
Application #:
|
09891678
|
Filing Dt:
|
06/25/2001
|
Title:
|
OPTICAL TRACK DRAIN PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/18/2003
|
Application #:
|
09895767
|
Filing Dt:
|
06/29/2001
|
Title:
|
METHOD FOR MOLDING SEMICONDUCTOR PACKAGE HAVING A CERAMIC SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/15/2003
|
Application #:
|
09895994
|
Filing Dt:
|
06/28/2001
|
Title:
|
PRE-DRILLED IMAGE SENSOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2003
|
Application #:
|
09895996
|
Filing Dt:
|
06/28/2001
|
Title:
|
STRUCTURE FOR BACKSIDE SAW CAVITY PROTECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2004
|
Application #:
|
09896014
|
Filing Dt:
|
06/28/2001
|
Title:
|
METHOD FOR FORMING AN IMAGE SENSOR PACKAGE WITH VISION DIE IN LENS HOUSING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/04/2004
|
Application #:
|
09896074
|
Filing Dt:
|
06/28/2001
|
Title:
|
PRE-DRILLED IMAGE SENSOR PACKAGE FABRICATION METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
04/06/2004
|
Application #:
|
09906868
|
Filing Dt:
|
07/16/2001
|
Title:
|
METHOD OF FABRICATING AND USING AN IMAGE SENSOR PACKAGE WITH REFLECTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2004
|
Application #:
|
09906992
|
Filing Dt:
|
07/16/2001
|
Title:
|
IMAGE SENSOR PACKAGE WITH REFLECTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2003
|
Application #:
|
09909160
|
Filing Dt:
|
07/18/2001
|
Title:
|
INTEGRATED CIRCUIT CHIP PACKAGE HAVING AN INTERNAL LEAD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/01/2003
|
Application #:
|
09916716
|
Filing Dt:
|
07/26/2001
|
Title:
|
REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09916719
|
Filing Dt:
|
07/26/2001
|
Title:
|
METHOD FOR FORMING A REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09916848
|
Filing Dt:
|
07/26/2001
|
Title:
|
PRE-DRILLED BALL GRID ARRAY PACKAGE
|
|