Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 042393/0631 | |
| Pages: | 5 |
| | Recorded: | 05/03/2017 | | |
Attorney Dkt #: | 20150388/24061.3448US02 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF ASSIGNOR CHIH-WEI LIN PREVIOUSLY RECORDED ON REEL 040662 FRAME 0532. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2018
|
Application #:
|
15369460
|
Filing Dt:
|
12/05/2016
|
Publication #:
|
|
Pub Dt:
|
04/20/2017
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURE WITH INSERTION LAYER AND METHOD FOR MANUFACTURING THE SAME
|
|
Assignee
|
|
|
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
|
Correspondence name and address
|
|
HAYNES AND BOONE, LLP
|
|
2323 VICTORY, SUITE 700
|
|
DALLAS, TX 75219
|
Search Results as of:
05/30/2024 09:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|