Patent Assignment Details
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| Reel/Frame: | 013049/0632 | |
| Pages: | 4 |
| | Recorded: | 06/24/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/06/2005
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Application #:
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10178372
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Filing Dt:
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06/24/2002
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Publication #:
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Pub Dt:
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12/25/2003
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT PACKAGE
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Assignee
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| QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD |
| TSUEN WAN, NT, HONG KONG |
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Correspondence name and address
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MILBANK, TWEED, HADLEY ET AL.
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CHRISTOPHER J. GASPAR
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ONE CHASE MANHATTAN PLAZA
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NEW YORK, NY 10005
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