Patent Assignment Details
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Reel/Frame: | 055092/0632 | |
| Pages: | 4 |
| | Recorded: | 02/01/2021 | | |
Attorney Dkt #: | ONS02635C01US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/24/2023
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Application #:
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17163674
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Filing Dt:
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02/01/2021
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Publication #:
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Pub Dt:
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05/27/2021
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Title:
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METHODS OF FORMING SEMICONDUCTOR PACKAGES WITH BACK SIDE METAL
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Assignee
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5005 EAST MCDOWELL ROAD, MD A700 |
PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 EAST MCDOWELL ROAD
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MD A700
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PHOENIX, AZ 85008
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05/28/2024 10:27 AM
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