Patent Assignment Details
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| Reel/Frame: | 055781/0632 | |
| Pages: | 5 |
| | Recorded: | 03/31/2021 | | |
| Attorney Dkt #: | US83782 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17218556
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Filing Dt:
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03/31/2021
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Publication #:
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Pub Dt:
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07/28/2022
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Title:
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METHOD FOR MANUFACTURING A PACKAGED CIRCUIT STRUCTURE
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Assignees
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| NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| QINHUANGDAO, CHINA |
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| DISTRICT B, ROOM 403,BLOCK B,,RONGCHAO BINHAI BUILDING,NO. 2021,HAIXIU ROAD, |
| SHENZHEN, CHINA |
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Correspondence name and address
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TUNG-YUN MCNALLY
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550 S. HOPE STREET, SUITE 2825
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LOS ANGELES, CA 90071
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06/29/2024 10:33 AM
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