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Reel/Frame:042786/0634   Pages: 10
Recorded: 06/22/2017
Attorney Dkt #:20110292/24061-3305US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
01/14/2020
Application #:
15094697
Filing Dt:
04/08/2016
Publication #:
Pub Dt:
12/22/2016
Title:
INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF
Assignors
1
Exec Dt:
07/27/2016
2
Exec Dt:
04/17/2016
3
Exec Dt:
03/20/2017
4
Exec Dt:
01/23/2017
5
Exec Dt:
05/19/2016
6
Exec Dt:
03/17/2017
7
Exec Dt:
03/23/2017
8
Exec Dt:
01/23/2017
9
Exec Dt:
01/20/2017
10
Exec Dt:
03/16/2017
11
Exec Dt:
05/19/2016
12
Exec Dt:
05/20/2017
Assignee
1
NO. 8, LI-HSIN RD. 6,
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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