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Total properties:
10
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|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
15157197
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Filing Dt:
|
05/17/2016
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|
Publication #:
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Pub Dt:
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11/24/2016
| | | | |
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Title:
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THROUGH-DIELECTRIC-VIAS (TDVs) FOR 3D INTEGRATED CIRCUITS IN SILICON
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|
|
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Patent #:
|
|
Issue Dt:
|
08/02/2022
|
Application #:
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16734758
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Filing Dt:
|
01/06/2020
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|
Publication #:
|
|
Pub Dt:
|
05/07/2020
| | | | |
|
Title:
|
Fine Pitch Bva Using Reconstituted Wafer With Area Array Accessible For Testing
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/28/2023
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Application #:
|
16837948
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Filing Dt:
|
04/01/2020
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Publication #:
|
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Pub Dt:
|
10/08/2020
| | | | |
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Title:
|
OVER AND UNDER INTERCONNECTS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/12/2024
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Application #:
|
17340469
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Filing Dt:
|
06/07/2021
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Publication #:
|
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Pub Dt:
|
11/25/2021
| | | | |
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Title:
|
3d-Interconnect
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
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Application #:
|
17362557
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Filing Dt:
|
06/29/2021
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|
Publication #:
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|
Pub Dt:
|
01/06/2022
| | | | |
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Title:
|
TECHNIQUES FOR MANUFACTURING SPLIT-CELL 3D-NAND MEMORY DEVICES
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17362712
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Filing Dt:
|
06/29/2021
|
|
Publication #:
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|
Pub Dt:
|
10/21/2021
| | | | |
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Title:
|
EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
06/25/2024
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Application #:
|
17509887
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Filing Dt:
|
10/25/2021
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|
Publication #:
|
|
Pub Dt:
|
05/05/2022
| | | | |
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Title:
|
REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/22/2023
|
Application #:
|
17512123
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Filing Dt:
|
10/27/2021
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|
Publication #:
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|
Pub Dt:
|
05/26/2022
| | | | |
|
Title:
|
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
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|
|
|
|
Patent #:
|
NONE
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Issue Dt:
|
|
Application #:
|
17525559
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Filing Dt:
|
11/12/2021
|
|
Publication #:
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|
Pub Dt:
|
05/18/2023
| | | | |
|
Title:
|
3D-Interconnect with Electromagnetic Interference ("EMI") Shield and/or Antenna
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/04/2024
|
Application #:
|
17545322
|
Filing Dt:
|
12/08/2021
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|
Publication #:
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|
Pub Dt:
|
03/31/2022
| | | | |
|
Title:
|
Advanced Device Assembly Structures And Methods
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|
