Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060373/0635 | |
| Pages: | 4 |
| | Recorded: | 06/30/2022 | | |
| Attorney Dkt #: | 4448-0736PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17854489
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Filing Dt:
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06/30/2022
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Publication #:
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Pub Dt:
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10/05/2023
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Title:
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COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF
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Assignees
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| 2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST. |
| TAIPEI CITY, TAIWAN 114754 |
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| NO. 6, TECHNOLOGY ROAD 5 |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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06/20/2024 10:55 PM
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