Patent Assignment Details
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Reel/Frame: | 011136/0637 | |
| Pages: | 4 |
| | Recorded: | 08/28/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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09649429
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Filing Dt:
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08/28/2000
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Title:
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METHOD FOR FORMING A PLANARIZING PAD FOR PLANARIZATION OF MICROELECTRONIC SUBSTRATES
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Assignee
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8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83706 |
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Correspondence name and address
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PERKINS COIE LLP
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JOHN M. WECHKIN
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P.O.BOX 1247
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PATENT-SEA
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SEATTLE WA 98111-1247
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