Patent Assignment Details
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Reel/Frame: | 030470/0641 | |
| Pages: | 6 |
| | Recorded: | 05/23/2013 | | |
Attorney Dkt #: | ETTP0039USA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2016
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Application #:
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13900552
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Filing Dt:
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05/23/2013
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Publication #:
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Pub Dt:
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02/13/2014
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Title:
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Conductive Substrate and Touch Panel Having Conductive Pads of Different Dimensions for Impedance Compensation and Reduction
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Assignees
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21F, 88, SEC. 1, HSIN-TAI-WU RD., XIZHI DIST. |
NEW TAIPEI CITY, TAIWAN |
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NO.2, NANYUAN RD., ZHONGLI CITY |
TAOYUAN COUNTY, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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