|
Total properties:
14
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/1997
|
Application #:
|
08497019
|
Filing Dt:
|
06/30/1995
|
|
Title:
|
PROCESS FOR ASSEMBLING ELECTRONICS USING MICROWAVE IRRADIATION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/12/1998
|
Application #:
|
08497603
|
Filing Dt:
|
06/30/1995
|
|
Title:
|
SYSTEM AND APPARATUS FOR REDUCING ARCING AND LOCALIZED HEATING DURING MICROWAVE PROCESSING
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/1997
|
Application #:
|
08531045
|
Filing Dt:
|
09/20/1995
|
|
Title:
|
SYSTEMS AND METHODS FOR MONITORING MATERIAL PROPERTIES USING MICROWAVE ENERGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/06/2001
|
Application #:
|
08625752
|
Filing Dt:
|
03/29/1996
|
|
Title:
|
CONDUCTIVE INSERT FOR BONDING COMPONENTS WITH MICROWAVE ENERGY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/1998
|
Application #:
|
08716043
|
Filing Dt:
|
09/19/1996
|
|
Title:
|
CURING POLYMER LAYERS ON SEMICONDUCTOR SUBSTRATES USING VARIABLE FREQUENCY MICROWAVE ENERGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/09/1999
|
Application #:
|
08947945
|
Filing Dt:
|
10/09/1997
|
|
Title:
|
CURING POLYMER LAYERS ON SEMICONDUCTOR SUBSTRATES USING VARIABLE FREQUENCY MICROWAVE ENERGY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/15/2000
|
Application #:
|
08964139
|
Filing Dt:
|
11/06/1997
|
|
Title:
|
MICROWAVE CURABLE ADHESIVE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2011
|
Application #:
|
12807994
|
Filing Dt:
|
09/17/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2011
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR CONTROLLED THERMAL PROCESSING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2011
|
Application #:
|
12924004
|
Filing Dt:
|
09/17/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2011
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR UNIFORM MICROWAVE TREATMENT OF SEMICONDUCTOR WAFERS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/29/2016
|
Application #:
|
13506722
|
Filing Dt:
|
05/11/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/14/2013
| | | | |
|
Title:
|
METHOD FOR LOWER THERMAL BUDGET MULTIPLE CURES IN SEMICONDUCTOR PACKAGING
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13506723
|
Filing Dt:
|
05/11/2012
|
|
Publication #:
|
|
Pub Dt:
|
11/14/2013
| | | | |
|
Title:
|
Method for lower thermal budget multiple cures in semiconductor packaging
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/29/2017
|
Application #:
|
13573947
|
Filing Dt:
|
10/15/2012
|
|
Publication #:
|
|
Pub Dt:
|
04/17/2014
| | | | |
|
Title:
|
Apparatus and method for heat treatment of coatings on substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/05/2019
|
Application #:
|
13986012
|
Filing Dt:
|
03/22/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/25/2014
| | | | |
|
Title:
|
Method of curing thermoplastics with microwave energy
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2019
|
Application #:
|
13986250
|
Filing Dt:
|
04/16/2013
|
|
Publication #:
|
|
Pub Dt:
|
10/16/2014
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR CONTROLLED BROADBAND MICROWAVE HEATING
|
|
