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Reel/Frame:024526/0642   Pages: 3
Recorded: 06/13/2010
Attorney Dkt #:VISH-8794
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/19/2013
Application #:
12730230
Filing Dt:
03/24/2010
Publication #:
Pub Dt:
07/21/2011
Title:
SEMICONDUCTOR PACKAGES INCLUDING DIE AND L-SHAPED LEAD AND METHOD OF MANUFACTURE
Assignor
1
Exec Dt:
06/10/2010
Assignees
1
1234 MCINTOSH COURT
SUNNYVALE, CALIFORNIA 94087
2
11645 PUTTER WAY
LAS ALTOS, CALIFORNIA 94024
3
8F, NO. 30, LIN-CUAN ST, LING-YA DIST.
KAOHSIUNG, TAIWAN
4
NO. 117-16, CONG-SHI-XIN-CUN, ZUO-YIN
KAOHSIUNG, TAIWAN
5
NO. 24, LANE 323, WANZHONG ST., SANMIN DIST.
KAOHSIUNG, TAIWAN
Correspondence name and address
ERIC GASH
2 NORTH MARKET STREET, THIRD FLOOR
SAN JOSE, CA 95113

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