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Reel/Frame:	033009/0642			Pages:	18
		Recorded:	06/02/2014
Attorney Dkt #:	LINH3054/BEU
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 16

Patent #:	7045463	Issue Dt:	05/16/2006	Application #:	10904188	Filing Dt:	10/28/2004
Publication #:	US20060024965	Pub Dt:	02/02/2006
Title:	METHOD OF ETCHING CAVITIES HAVING DIFFERENT ASPECT RATIOS

Patent #:	7008821	Issue Dt:	03/07/2006	Application #:	10904621	Filing Dt:	11/19/2004
Publication #:	US20060057775	Pub Dt:	03/16/2006
Title:	METHOD OF FORMING A WAFER BACKSIDE INTERCONNECTING WIRE

Patent #:	7533564	Issue Dt:	05/19/2009	Application #:	11381129	Filing Dt:	05/02/2006
Publication #:	US20080060454	Pub Dt:	03/13/2008
Title:	MICRO SAMPLE HEATING APPARATUS AND METHOD OF MAKING THE SAME

Patent #:	7361284	Issue Dt:	04/22/2008	Application #:	11426013	Filing Dt:	06/23/2006
Publication #:	US20070218584	Pub Dt:	09/20/2007
Title:	METHOD FOR WAFER-LEVEL PACKAGE

Patent #:	7395706	Issue Dt:	07/08/2008	Application #:	11426015	Filing Dt:	06/23/2006
Publication #:	US20070234794	Pub Dt:	10/11/2007
Title:	MICRO SAMPLE HEATING APPARATUS AND METHOD OF MAKING THE SAME

Patent #:	7258806	Issue Dt:	08/21/2007	Application #:	11426017	Filing Dt:	06/23/2006
Title:	METHOD OF FABRICATING A DIAPHRAGM OF A CAPACITIVE MICROPHONE DEVICE

Patent #:	7585417	Issue Dt:	09/08/2009	Application #:	11426018	Filing Dt:	06/23/2006
Publication #:	US20070235407	Pub Dt:	10/11/2007
Title:	METHOD OF FABRICATING A DIAPHRAGM OF A CAPACITIVE MICROPHONE DEVICE

Patent #:	7598125	Issue Dt:	10/06/2009	Application #:	11426573	Filing Dt:	06/26/2006
Publication #:	US20070161158	Pub Dt:	07/12/2007
Title:	METHOD FOR WAFER LEVEL PACKAGING AND FABRICATING CAP STRUCTURES

Patent #:	7582511	Issue Dt:	09/01/2009	Application #:	11434734	Filing Dt:	05/17/2006
Publication #:	US20070161155	Pub Dt:	07/12/2007
Title:	METHOD FOR WAFER LEVEL CHIP SCALE PACKAGING WITH PASSIVE COMPONENTS INTEGRATED INTO PACKAGING STRUCTURE

Patent #:	7622334	Issue Dt:	11/24/2009	Application #:	12100392	Filing Dt:	04/09/2008
Publication #:	US20090061598	Pub Dt:	03/05/2009
Title:	WAFER-LEVEL PACKAGING CUTTING METHOD CAPABLE OF PROTECTING CONTACT PADS

Patent #:	7987588	Issue Dt:	08/02/2011	Application #:	12273550	Filing Dt:	11/19/2008
Publication #:	US20090064496	Pub Dt:	03/12/2009
Title:	INTERPOSER FOR CONNECTING PLURALITY OF CHIPS AND METHOD FOR MANUFACTURING THE SAME

Patent #:	8456724	Issue Dt:	06/04/2013	Application #:	12817338	Filing Dt:	06/17/2010
Publication #:	US20110310452	Pub Dt:	12/22/2011
Title:	BIAXIAL SCANNING MIRROR FOR IMAGE FORMING APPARATUS

Patent #:	8305671	Issue Dt:	11/06/2012	Application #:	12819264	Filing Dt:	06/21/2010
Publication #:	US20110310451	Pub Dt:	12/22/2011
Title:	BIAXIAL SCANNING MIRROR FOR IMAGE FORMING APPARATUS AND METHOD FOR OPERATING THE SAME

Patent #:	8310328	Issue Dt:	11/13/2012	Application #:	12899836	Filing Dt:	10/07/2010
Publication #:	US20120086537	Pub Dt:	04/12/2012
Title:	PLANAR COIL AND METHOD OF MAKING THE SAME

Patent #:	8453318	Issue Dt:	06/04/2013	Application #:	13651771	Filing Dt:	10/15/2012
Publication #:	US20130043136	Pub Dt:	02/21/2013
Title:	Method for making a planar coil

Assignor

Exec Dt:

04/14/2014

Assignee

9F., NO. 170, SEC. 3, MIN CHUAN EAST ROAD, JHONGSHAN DIST.,

TAIPEI, TAIWAN

Correspondence name and address
	BACON&THOMAS, PLLC
	625 SLATERS LANE, 4TH FL
	ALEXANDRIA, VA 22314

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