Patent Assignment Details
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Reel/Frame: | 016805/0643 | |
| Pages: | 3 |
| | Recorded: | 07/22/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/17/2007
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Application #:
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11186763
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Filing Dt:
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07/22/2005
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Publication #:
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Pub Dt:
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09/28/2006
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE HAVING A GAP AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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