Patent Assignment Details
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| Reel/Frame: | 022942/0646 | |
| Pages: | 3 |
| | Recorded: | 07/10/2009 | | |
| Attorney Dkt #: | 4459-312 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/13/2011
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Application #:
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12501309
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Filing Dt:
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07/10/2009
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Publication #:
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Pub Dt:
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01/14/2010
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Title:
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SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING WIRE, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
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Assignee
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| NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP
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1700 DIAGONAL ROAD
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SUITE 300
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ALEXANDRIA, VA 22314
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