Patent Assignment Details
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Reel/Frame: | 045185/0646 | |
| Pages: | 3 |
| | Recorded: | 03/13/2018 | | |
Attorney Dkt #: | 2515.0505 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/2019
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Application #:
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15919401
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Filing Dt:
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03/13/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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METHOD OF PACKAGING THIN DIE AND SEMICONDUCTOR DEVICE INCLUDING THIN DIE
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Assignee
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10 ANG MO KIO STREET 65 |
TECHPOINT #04-08/09 |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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STATS CHIPPAC/PATENT LAW GROUP: ATKINS A
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55 N. ARIZONA PLACE, SUITE 104
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CHANDLER, AZ 85225
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