|
Total properties:
10
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
13569458
|
Filing Dt:
|
08/08/2012
|
|
Publication #:
|
|
Pub Dt:
|
02/13/2014
| | | | |
|
Title:
|
High-Efficiency, Low-Power Power Supply Circuit
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
13646697
|
Filing Dt:
|
10/06/2012
|
|
Title:
|
Reflow of Thermoplastic Sheet for Passivation of Power Integrated Circuits
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2018
|
Application #:
|
13662384
|
Filing Dt:
|
10/26/2012
|
|
Publication #:
|
|
Pub Dt:
|
05/01/2014
| | | | |
|
Title:
|
IGBT DIE STRUCTURE WITH AUXILIARY P WELL TERMINAL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2014
|
Application #:
|
13662395
|
Filing Dt:
|
10/26/2012
|
|
Title:
|
IGBT ASSEMBLY HAVING CIRCUITRY FOR INJECTING/EXTRACTING CURRENT INTO/FROM AN AUXILIARY P WELL
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/30/2014
|
Application #:
|
13791906
|
Filing Dt:
|
03/08/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/11/2014
| | | | |
|
Title:
|
Module and Assembly with Dual DC-Links for Three-Level NPC Applications
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
14144587
|
Filing Dt:
|
12/31/2013
|
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
|
Title:
|
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EXPOSED ON THE OUTSIDE OF THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
14152989
|
Filing Dt:
|
01/10/2014
|
|
Publication #:
|
|
Pub Dt:
|
05/08/2014
| | | | |
|
Title:
|
NON-ISOLATED AC-TO-DC CONVERTER HAVING A LOW CHARGING CURRENT INITIAL POWER UP MODE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/2015
|
Application #:
|
14450262
|
Filing Dt:
|
08/03/2014
|
|
Publication #:
|
|
Pub Dt:
|
11/20/2014
| | | | |
|
Title:
|
MODULE AND ASSEMBLY WITH DUAL DC-LINKS FOR THREE-LEVEL NPC APPLICATIONS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
14622869
|
Filing Dt:
|
02/15/2015
|
|
Publication #:
|
|
Pub Dt:
|
06/11/2015
| | | | |
|
Title:
|
SILVER-TO-SILVER BONDED IC PACKAGE HAVING TWO CERAMIC SUBSTRATES EXPOSED ON THE OUTSIDE OF THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/14/2017
|
Application #:
|
14700431
|
Filing Dt:
|
04/30/2015
|
|
Publication #:
|
|
Pub Dt:
|
08/20/2015
| | | | |
|
Title:
|
Non-Isolated AC-To-DC Converter With Fast Dep-FET Turn On And Turn Off
|
|
