Patent Assignment Details
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| Reel/Frame: | 010046/0647 | |
| Pages: | 3 |
| | Recorded: | 06/11/1999 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2002
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Application #:
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09330906
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Filing Dt:
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06/11/1999
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Title:
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SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
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Assignee
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| SUITE 533 |
| 300 DELAWARE AVENUE |
| WILMINGTON, DELAWARE 19801 |
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Correspondence name and address
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SYNNESTVEDT & LECHNER LLP
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PETER J. BUTCH III, ESQ.
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2600 ARAMARK TOWER
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PHILADELPHIA, PA 19107
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