Patent Assignment Details
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Reel/Frame: | 012830/0647 | |
| Pages: | 2 |
| | Recorded: | 04/19/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/2004
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Application #:
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10125543
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Filing Dt:
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04/19/2002
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Publication #:
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Pub Dt:
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12/05/2002
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Title:
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RESIN POWDER FOR MOLDING AND PREPARATION PROCESS OF SAME
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Assignee
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2-CHOME, KITA-KU, OSAKA-SHI |
UMEDA CENTER BUILDING, 4-12, NAKAZAKI-NISHI |
OSAKA 530-8323, JAPAN |
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Correspondence name and address
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SUGHRUE MION, PLLC
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ABRAHAM J. ROSNER
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, D.C. 20037-3213
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