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Reel/Frame:019058/0649   Pages: 4
Recorded: 03/21/2007
Attorney Dkt #:B-5688CIPCONT 865038-8
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/01/2007
Application #:
10980536
Filing Dt:
11/03/2004
Publication #:
Pub Dt:
03/24/2005
Title:
INTEGRATING CHIP SCALE PACKAGING METALLIZATION INTO INTEGRATED CIRCUIT DIE STRUCTURES
Assignors
1
Exec Dt:
03/19/2007
2
Exec Dt:
03/14/2007
Assignee
1
1849 FORTUNE DRIVE
SAN JOSE, CALIFORNIA 91531
Correspondence name and address
RICHARD P. BERG
LADAS & PARRY
5670 WILSHIRE BOULEVARD, #2100
LOS ANGLES, CA 90036

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