Patent Assignment Details
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| Reel/Frame: | 040978/0650 | |
| Pages: | 3 |
| | Recorded: | 01/16/2017 | | |
| Attorney Dkt #: | PS170003CYH |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15407198
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Filing Dt:
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01/16/2017
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Publication #:
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Pub Dt:
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07/20/2017
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Title:
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CLIP-BONDED SEMICONDUCTOR CHIP PACKAGE USING METAL BUMPS AND METHOD FOR MANUFACTURING THE PACKAGE
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Assignee
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| (DODANG-DONG) 102, GILJU-RO 425BEON-GIL, WONMI-GU, GYEONGGI-DO |
| BUCHEON-SI, KOREA, REPUBLIC OF 14487 |
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Correspondence name and address
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KORUS PATENT, LLC (ATTN: SEONG IL JEONG)
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3333 WARRENVILLE RD., SUITE 200
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LISLE, IL 60532
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